SJPCB Communication Products
SJPCB HDI boards for dense and high-speed electronic devices requiring compact routing.
SJPCB HDI PCB Manufacturing
SJPCB high-density interconnect PCB fabrication for compact electronic products with fine routing and advanced via structures. SJPCB supports up to 3rd order HDI with microvias and any-layer interconnects.
SJPCB high density
SJPCB compact PCB designs with advanced interconnects
SJPCB HDI PCB technology supports smaller products, higher wiring density, and better signal routing in limited board space. The SJPCB HDI team reviews your design for stackup, via structure, and impedance before production starts.
- SJPCB fine line width and spacing down to 2mil / 2mil
- SJPCB blind vias, buried vias, and microvia (0.1mm laser drill) structures
- SJPCB controlled impedance support with ±5% tolerance
- SJPCB up to 3rd order HDI and any-layer HDI available
- SJPCB HDI supports 1 to 32 layer board designs
SJPCB Medical Devices
SJPCB compact HDI PCB structures for space-limited medical and diagnostic devices.
SJPCB IoT Devices
SJPCB small-form HDI electronic boards for connected and IoT products.
Review your SJPCB HDI PCB requirements
SJPCB can help evaluate layer count, via structure, material, and finish for your HDI project.